发明名称 LAMINATE FILM WITH METAL LAYER, AND FLEXIBLE CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING IT
摘要 PROBLEM TO BE SOLVED: To provide a laminate film with a metal layer which comprises a heat-resistant resin layer and a metal layer, causes less camber and is high-quality with fewer appearance defects, e.g. tack marks and abnormal protrusions. SOLUTION: The laminate film with a metal layer has a metal layer 1 on one side of a laminate of two or more heat-resistant-resin layer 2 and 3. The outermost heat-resistant resin layer A with no contact with the metal layer contains a heat-resistant resin and a filler, and the filler has a median diameter of 0.1-7μm. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008188893(A) 申请公布日期 2008.08.21
申请号 JP20070026361 申请日期 2007.02.06
申请人 TORAY IND INC 发明人 WATANABE TAKUO
分类号 B32B15/088;B32B15/08;H05K1/03 主分类号 B32B15/088
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