UNDERFILL AGENT, SEMICONDUCTOR DEVICE OBTAINED BY USING THE SAME AND METHOD FOR PRODUCING THE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an underfill agent hardly elevating viscosity at a certain temperature or lower, having a short curing time and capable of reducing the void formation, a flip chip type semiconductor device prepared by using the underfill agent and a method for producing the flip chip type semiconductor device.

SOLUTION: This underfill agent filled between the semiconductor part and a substrate plate on flip chip-mounting the semiconductor part is provided by containing an aminomethylphenol type epoxy.

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