发明名称 |
Device and Method For Liquid Treatment of Wafer-Shaped Articles |
摘要 |
Method and device for wet treating a defined peripheral edge-region of a wafer-shaped article having a first surface plane W 1, a second surface plane W 2 and an edge surface. The device includes a support for holding the wafer-shaped article; liquid dispensing members for dispensing liquid onto the first surface plane W 1 of the wafer-shaped article not facing the support and liquid guiding member connected to the support for guiding at least a part of the liquid around the edge surface of the wafer-shaped article towards the second surface plane W 2 of the wafer-shaped article facing the support thereby wetting at least the edge surface, wherein the liquid guiding member has the form of a ring.
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申请公布号 |
US2008196835(A1) |
申请公布日期 |
2008.08.21 |
申请号 |
US20060915352 |
申请日期 |
2006.05.18 |
申请人 |
SEZ AG |
发明人 |
BALDY ANDREAS;GIGACHER MARKUS;BRUGGER MICHAEL |
分类号 |
H01L21/306;B05C13/00;B08B3/04 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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