| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board capable of directly performing an electric connection with an IC chip, without going via lead parts. <P>SOLUTION: The multilayered printed wiring board has a preliminarily built-in IC chip 20 in a core substrate 30; and a transition layer 38 comprising a first thin layer 33, a second thin layer 36, and a thick forming layer 37 is arranged in the copper die pad 24 of the IC chip 20. Consequently, electrical connection can be obtained between the IC chip and the multilayered board, without having to use leading parts and a sealing resin. Furthermore, connection properties and reliability between the die pad 24 and a via hole 60 can be improved by forming a plurality of transition layers 38 on the die pad 24. <P>COPYRIGHT: (C)2008,JPO&INPIT |
