| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component in which an electronic element can be protected in compact manner and a manufacturing cost can be reduced. <P>SOLUTION: The electronic component is provided with a plate-like conductive section 1, an electronic element 2 disposed on one plane of the conductive section, a connector 3 connected to the electronic element and separated in parallel with the one plane, and a potting resin 4 for protecting the electronic element by injection molding sealing. The conductive section has a placing plate 5 for placing the electronic element on a protruding plate and a groove 6 surrounding the placing plate; the viscosity of the potting resin is set according to the separation distance of between a placed electronic element and the connector separated in parallel to the electronic element, in order to realize a situation where the potting resin is supplied from the upper part of the connector and at least the part between the electronic element and the connector separated in parallel to the electronic element is sealed to fill the groove. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
