| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for a semiconductor package having advantages which a solid epoxy resin composition and liquid epoxy resin composition are provided with, and also to provide a method of molding the semiconductor package, and a resin composition feeder for the semiconductor package. SOLUTION: This invention relates to the resin composition for the semiconductor package that not only shows a liquid state at 45°C-105°C in addition to a solid state at 35°C or less, but also is hardened in 3 min at 200°C or less. The invention also relates to the method of molding the semiconductor package wherein a liquid resin composition accommodated in a heat insulating tank 2 is supplied to a metal mold for sealing a semiconductor element through a pipe 4. Additionally, the resin composition feeder for semiconductor package 1 includes the heat insulating tank having: at least a pressure reducing function, heat insulating function and pressurizing function; the pipe 4 connected thereto; and a mechanism for conveying through the pipe 4 the resin composition to a pot of the metal mold for shielding and molding the semiconductor element. COPYRIGHT: (C)2008,JPO&INPIT |
