| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat collecting device for a heat pump, easily and at a low cost by using surface heat from an underfloor ground surface of a building. SOLUTION: According to the structure of the heat collecting device, when the building 1 is constructed, a concrete sealed mat foundation 2 is formed, and heat insulation panels 4 having a width of 1 to 2 m are flatly and horizontally arranged outside the foundation 2, followed by filling fluid onto a concrete layer 22 of the sealed mat foundation 2. Then heat collecting laid bodies 5 each covering an upper surface and side surfaces thereof with heat insulation materials 8 are rigidly mounted, and heat is collected from enclosed heat collecting surface 3 enclosed by the sealed mat foundation 2 via the concrete layer 22 to the fluid of the heat collecting laid bodies 5, followed by circulating the fluid between the heat pump B and the laid bodies 5 by a pump 9. The enclosed heat collecting surface 3 is not influenced by the ambient air, and therefore it is held at a relatively constant temperature, which leads to effective use of heat collection of the heat pump for obtaining cooling and heating energy. COPYRIGHT: (C)2008,JPO&INPIT
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