| 摘要 |
PROBLEM TO BE SOLVED: To prevent an abnormality of sealing including resin leakage and damage to moldings, and retain the high precision of sealing. SOLUTION: A resin sealing device has an upper mold 102 and a lower mold 104 which is arranged opposite to the upper mold 102 and can access and/or separate from the upper mold 102, and a target molding 160 is compression-sealed with resin in a cavity 140 formed in a part of the opposite surface 110 of the lower mold 104. The device is provided with a release film 150 which is formed on the opposite surface 110 and held to the opposite surface 110 by adsorption at specified timing and an air cleaning mechanism 126 which cleans the opposite surface 110 with air when the release film 150 is not adsorption-held to the opposite surface 110. COPYRIGHT: (C)2008,JPO&INPIT
|
