| 摘要 |
This invention provides a semiconductor module (10) comprising a ceramic substrate having a semiconductor element (12) mounting surface and a backside remote from the semiconductor element (12) mounting surface, a top surface metal plate (15) joined on the surface of the substrate, a back metal plate (16) joined to the backside, and a heat sink (13) joined to the back metal plate (16). The back metal plate (16) has a joint surface (16b) facing the heat sink (13). The joint surface (16b) includes a joint area and a non-joint area. The non-joint area includes a concave part extended in the thicknesswise direction of the back metal plate (16). The area of the joint area in the back metal plate (16) is 65% to 85% based on the whole area in the joint surface (16b) of the back metal plate (16). According to the above constitution, excellent heat dissipation properties can be realized while preventing the occurrence of heat stress-derived warpage or cracking. |
