| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grinding fixture capable of preventing grinding sludge from entering a space between a grinding surface and a grinding platen when a semiconductor substrate is ground by use of the grinding platen. <P>SOLUTION: When a semiconductor substrate 4 is ground, the lower end surface 20a of an outer guide 20 is ground simultaneously, grinding sludge generated enters a portion between a grinding surface and a grinding platen, and the surface state of the grinding surface is deteriorated. Two cuttings 20b and 20c are formed in the lower end surface 20a of the outer guide 20 positioned on anterior and posterior portions in the direction of the rotation of the grinding platen. Consequently, the generation of grinding sludge which enters a portion between the grinding surface and the grinding platen can be prevented and the surface state of the grinding surface can be improved. <P>COPYRIGHT: (C)2008,JPO&INPIT |
