发明名称 MOLD ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To melt tablets consisting of a resin material in the inside of a mold uniformly in a short time. SOLUTION: The mold assembly is furnished with a pair of molds having a cavity 10 for molding a resin material 18, a void part 11 provided on either of this pair of molds and connected with the cavity 10 through a gate part 13 and a sprue part 12, and a plunger part that melts the resin material 18 supplied to this void part 11 before pressing this molten resin material 18 to transfer to and fill the cavity 10. The plunger part consists of a head part 15 and a pushing mechanism 16 that pushes by pressure this head part 15, and the top face of the head part 15 is provided with recesses and projections 19, 20. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008188924(A) 申请公布日期 2008.08.21
申请号 JP20070027512 申请日期 2007.02.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKAGAWA KEIZO
分类号 B29C45/02;B29C45/26;B29L31/34 主分类号 B29C45/02
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