| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure capable of suppressing occurrences of position deviations, or the like for electrodes of electronic parts and terminals of substrates, in mounting the electronic component to the substrate. SOLUTION: The mounting structure comprises electronic parts containing electrodes; and a substrate mounted with electronic parts and having terminals. Electronic parts are joined to the substrate through a normal temperature curable adhesive containing a base and a curing agent for curing it, and electrodes electrically connects with terminals. Therefore, in mounting, electronic parts are mechanically connected on the substrate through the normal temperature curable adhesive. Because of this, electronic parts do not thermal-deform, such as thermal expansion and thermal contraction, etc., and electronic parts do not give unwanted large stresses to the substrate. As a result, even if the substrate is formed thinly, the substrate does not deform in mounting, and it is possible to suppress the deformation of the substrate, and electrical connections between electrodes and terminals of the substrate in position deviations. COPYRIGHT: (C)2008,JPO&INPIT |
