发明名称 BONDING METHOD AND MANUFACTURING METHOD OF LIQUID DROPLET DISCHARGE HEAD
摘要 PROBLEM TO BE SOLVED: To provide a bonding method regulating the leak out of bond and a manufacturing method of a liquid droplet discharge method. SOLUTION: The bonding method for regulating the leak out of bond includes a coating step of coating a mixture bond 55 on the bonding areas of a nozzle substrates 11, a partially solidifying step of forming bank portions 22a by partially solidifying areas corresponding to the peripheral portions of nozzle opening portions 21 of the coating mixture bond 55, an affixing step of affixing the nozzle substrates 11 and flowing channel forming substrates 12, and a main solidifying step of forming bond layers 22 by solidifying the whole mixture bond 55. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008188869(A) 申请公布日期 2008.08.21
申请号 JP20070025439 申请日期 2007.02.05
申请人 SEIKO EPSON CORP 发明人 MATSUO YASUHIDE
分类号 B41J2/16;B29C65/52;C09J5/00;C09J201/00 主分类号 B41J2/16
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