| 摘要 |
For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils ( 1 ) comprising channels ( 2 ) for coolant and one base plate ( 5 ) adapted to be brought into thermal contact with the electronic component ( 4 ) through a thermal contact surface ( 6 ), said metal foils ( 1 ) and said base plate ( 5 ) being joined together so as to form a single piece of material, said channels ( 2 ) having a width b ranging from 100 to 350 mum, a depth t ranging from 30 to 150 mum, a mean spacing s ranging from 30 to 300 mum, residual foil thickness r remaining after formation of the channels ( 2 ) in the metal foils ( 1 ) ranging from 30 to 300 mum and said base plate ( 5 ) having a thickness g ranging from 100 to 1,000 mum, said cooler further having at least one splitting chamber ( 10 ) traversing the metal foils ( 1 ) approximately in the region of the thermal contact surface ( 6 ), said chamber communicating with a respective inlet-side end of all or of the selected channels ( 2 ) through channel inlet ports, at least one inlet chamber ( 20 ) for admission of coolant into the cooler ( 3 ), said chamber communicating with the at least one splitting chamber ( 10 ), at least one collecting chamber ( 11 ) traversing the metal foils ( 1 ) and communicating with a respective outlet-side end of all or selected channels ( 2 ) through channel outlet ports and at least one outlet chamber ( 21 ) for discharging coolant from said cooler ( 3 ), said chamber communicating with said at least one collecting chamber ( 11 ), the depth of said channels ( 2 ) in a channel layer adjacent said base plate ( 5 ) being greater than the depth of the channels ( 2 ) in a channel layer located in the stack on the side opposite said base plate ( 5 ).
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