发明名称 LIQUID CURABLE COMPOSITION, METHOD OF COATING, INORGANIC SUBSTRATE PLATE AND SEMICONDUCTOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a liquid curable composition excellent in preservation stability and capable of forming a hard silica-based layer; a method of coating, capable of forming a hard silica-based layer excellent in uniformity, flatness, crack resistance and close adhesion; an inorganic substrate plate excellent in heat resistance, cold resistance, electric insulation, mechanical strength, chemical resistance, etc.; and a semiconductor device excellent in accuracy, reliability and stability over a long period of time. <P>SOLUTION: This liquid curable composition is obtained by performing the condensation reaction or hydrolytic condensation reaction of a hydrogen halosilane or an alkoxysilane in an organic solvent dispersed with polyvalent metal oxide fine particles having hydroxy group. The method for coating the inorganic substrate plate is provided by coating the composition on the inorganic substrate plate and curing to form the hard silica-based layer. The inorganic substrate plate having the hard silica-based layer and the semiconductor device having the semiconductor layer on the above inorganic substrate plate are also provided. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008189765(A) 申请公布日期 2008.08.21
申请号 JP20070024477 申请日期 2007.02.02
申请人 DOW CORNING TORAY CO LTD;DOW CORNING CORP 发明人 HARIHARA YUKINARI;ITO MAKI;KATSOULIS DIMITRIS ELIAS
分类号 C09D183/05;B05D7/24;B32B27/00;C01B33/18;C08G77/12;C08G77/58;C09D1/00;C09D183/04;C09D185/00 主分类号 C09D183/05
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