| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method for easily processing a resin body having a low absorptivity for the wavelength of a laser beam. <P>SOLUTION: When a resin layer 15 of a flat cable 11 is machined by irradiating it with a laser beam L, a light absorption layer 9 containing a light absorption substance in which absorptivity for the wavelength of the laser beam L is higher than that of the resin layer 15, is formed on the surface of the resin layer 15. Then, the light absorption layer 9 is heated by irradiating it with the laser beam L, and the resin layer 15 is machined by the heat generated therein. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
