| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to form a high-definition gap between electrodes without deteriorating the simplicity of a process possessed by an ink-jet technology. SOLUTION: An electronic device manufacturing method comprises the steps of applying a water repellent 21 onto a substrate 2 using an ink-jet method and thereby forming a water-repellent region 22 on the substrate, dropping a liquid containing a conductive ink material on the substrate along the water-repellent region using the ink-jet method, thereby forming a source electrode (8a) and a drain electrode (8b), and forming a semiconductor layer (10) in such a manner that the water-repellent region, the source electrode, and the drain electrode are covered with the layer. COPYRIGHT: (C)2008,JPO&INPIT
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