| 摘要 |
PROBLEM TO BE SOLVED: To provide a shielding structure which can fix two substrates with sufficient strength, while electrically connecting them to each other without causing thickness to increase. SOLUTION: In the shield structure, a main substrate 1 mounted with a shielding case 3 having a top plate and formed of a conductive material and a sub substrate 2, having a conductive region exposed in at least part of the face opposite to the main substrate 1 are fixed via two kinds of double-sided tapes, that is, a conductive double-sided tape 6 and a non-conductive double-sided tape 7, which are pasted to the top plate of the shielding case 3. The conductive double-sided tape 6 abuts on gold plating formed on the sub substrate 2. COPYRIGHT: (C)2008,JPO&INPIT
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