| 摘要 |
PROBLEM TO BE SOLVED: To provide a beam profile measuring apparatus for measuring a beam profile of a light beam scanned at an operation time, in order to enable an influence to be grasped precisely, which is caused by a wave-like undulation deformation of a mirror plane for example, in an operation of an vibrating mirror. SOLUTION: The beam profile measuring apparatus 1 comprises: a CCD of a CCD camera 2 being a detection plane which detects the beam profile of the light beam scanned by the vibrating mirror 460; a light source driving means 3 for bringing a light source means 107, 108 to light in a pulse form at a given timing when the light beam passes through the detecting plane; and a CCD camera control box 4 being a detection plane control means for carrying out the beam profile detection at the detection plane in response to the timing when the light beam passes through the detection plane. COPYRIGHT: (C)2008,JPO&INPIT
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