发明名称 Thermally insulated CMC structure with internal cooling
摘要 An insulated CMC structure ( 20 A) formed of a CMC layer ( 22 A), a thermal insulation layer ( 24 A) applied to a front surface ( 30 A) of the CMC layer ( 22 A), and cooling channels ( 28 A) formed along the interface ( 26 A) between the CMC layer and the thermal insulation layer, thus directly cooling the thermally critical area of the interface. Embodiments include cooling channels in direct contact with both layers (FIG. 1 ); cooling channels in one layer and tangent to the other layer (FIGS. 4, 5 and 9 ); cooling channels in the CMC layer with an intervening wall ( 36 D, 36 E) that bulges into the thermal insulation layer for improved bonding thereof (FIGS. 6, 7 ); and cooling channels formed in ceramic tubes ( 38 F of FIG. 8 ).
申请公布号 US2008199661(A1) 申请公布日期 2008.08.21
申请号 US20070707191 申请日期 2007.02.15
申请人 SIEMENS POWER GENERATION, INC. 发明人 KELLER DOUGLAS A.;GONZALEZ MALBERTO F.;MERRILL GARY B.
分类号 B32B3/20 主分类号 B32B3/20
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