发明名称 Verfahren zum Trennen des Lötmaterials von der Oxidlötung
摘要 <p>There are disclosed a soldering apparatus comprising a solder wave shape forming means for melting solder and forming solder wave shape, and a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides, wherein said separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, as well as an agent and a method for separating solder and solder oxides. <IMAGE></p>
申请公布号 DE69939072(D1) 申请公布日期 2008.08.21
申请号 DE1999639072 申请日期 1999.02.13
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO. LTD. 发明人 KAWASHIMA, YASUJI;SHIMIZU, KAORU
分类号 B23K3/06;B23K1/018;B23K1/08;B23K1/20;B23K3/08;C22B25/06;C22B25/08;H05K3/34 主分类号 B23K3/06
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