发明名称
摘要 PROBLEM TO BE SOLVED: To make a raw material for a silicone composition containing a heat conductive filler and silicone best suited for a heat radiating member of an electronic apparatus by extrusion-molding the raw material at a specific shear rate. SOLUTION: A raw material for a silicone composition contains a raw material for silicone such as an addition reaction-type liquid silicone rubber or a heat-vulcanizable millable type silicone rubber and one kind or more than one kind of heat conductive filler such as boron nitride or aluminum nitride as essential components. The raw material for the composition is extrusion-molded at a shear rate of 20s-1 or more (when this shear rate is below 20s-1 it is impossible to sufficiently orient the heat conductive filler and difficult to sufficiently enhance the heat conductivity) into the silicone molding having a sectional shape such as a polygon, e.g. a triangle, circle or ellipse. The raw material for the silicone composition is prepared using a roll mill, a kneader, a Bambury mixer or the like and the silicone molding obtained by extrusion molding is cured with the help of a far infrared furnace, a hot blast furnace or the like. Thus, the raw material for the silicone composition is best suited for manufacturing a heat radiating member of an electronic apparatus.
申请公布号 JP4137288(B2) 申请公布日期 2008.08.20
申请号 JP19990154913 申请日期 1999.06.02
申请人 发明人
分类号 B29C47/00;H01L23/373;B29K83/00;B29K509/04;C08J5/00;C08K3/38;C08L83/04 主分类号 B29C47/00
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