发明名称 |
Low dielectric halogen-free resin composition and circuit board using the same |
摘要 |
A halogen-free resin composition includes (A) 100 parts by weight of polyphenylene oxide resin; (B) 10 to 50 parts by weight of maleimide resin; (C) 5 to 100 parts by weight of polybutadiene copolymer; (D) 5 to 30 parts by weight of cyanate ester resin; and (E) 15 to 150 parts by weight of phosphazene. The halogen-free resin composition is characterized by specific ingredients and proportions thereof to achieve circuit board laminate properties, such as a high glass transition temperature, low coefficient of thermal expansion, low dielectric properties, heat resistance, flame retardation, and being halogen-free, and thus is applicable to the manufacturing of a prepreg or resin film, thereby being applicable to the manufacturing of metal laminates and printed circuit boards. |
申请公布号 |
US9428646(B2) |
申请公布日期 |
2016.08.30 |
申请号 |
US201313948399 |
申请日期 |
2013.07.23 |
申请人 |
ELITE MATERIAL CO., LTD. |
发明人 |
Hsieh Chen-Yu |
分类号 |
C08G79/02;B32B15/14;C08L63/00;C08L71/02;H05K1/03 |
主分类号 |
C08G79/02 |
代理机构 |
WPAT, P.C., Intellectual Property Attorneys |
代理人 |
WPAT, P.C., Intellectual Property Attorneys ;King Anthony |
主权项 |
1. A halogen-free resin composition, comprising:
(A) 100 parts by weight of polyphenylene oxide resin; (B) 10 to 50 parts by weight of maleimide resin; (C) 5 to 100 parts by weight of polybutadiene copolymer; (D) 5 to 30 parts by weight of cyanate ester resin; and (E) 15 to 150 parts by weight of phosphazene, wherein the phoshazene is vinyl phoshazene, wherein the vinyl phosphazene comprises a structure expressed by formula (II): wherein n is an integer from 1 to 6. |
地址 |
Taoyuan TW |