| 摘要 |
FIELD: electricity. ^ SUBSTANCE: invention may be used for surface installation of electronic components with ball leads by flip-chip method and particularly for installation of electronic component with ball lead matrix. Installation method of electronic components with ball leads provides for application of flip-chip method including ball leads positioning, fastening and connection to printed circuit card mounting surface contacts, which are mechanically and electrically connected with plated-through holes by soldering. Prior to positioning, printed circuit card is turned over, with its mounting surface directed downwards, ball leads of electronic component being placed under plated-thought holes contacts, with the said special orientation of printed circuit card preserved for the time of all operation execution. ^ EFFECT: production of reliable high-quality soldered connection during surface installation of electronic components. ^ 4 cl, 4 dwg |
