| 摘要 |
A method for boning a connector is provided to prevent a contact error by fixing a contact pad of a first substrate structure and a connective hole of a second substrate structure to each other by using a solder. A first substrate structure(110) includes a contact pad(114) formed at an upper part thereof and a plurality of probes formed at a lower part. The probes come in contact with an inspecting target. A second substrate structure(120) is formed on the first substrate structure. The second substrate structure has a plurality of connective holes. A conductive layer is formed on inner walls of the connective holes in order to be connected to an inner signal line(118) of the second substrate structure. A plurality of connectors(130) have a flexible characteristic. One end of each connector is fixed to the contact pad of the first substrate structure. The other end of each connector is inserted into each of the connective holes in order to be fixed to the conductive layer.
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