| 摘要 |
<p>A semiconductor device is provided to significantly reduce negative influences due to environmental factors such as dust or solar light without using a separate member functioning as an environmental barrier. A semiconductor device includes a semiconductor sensor chip, a housing(5), an opening portion(3), and a cover member. The semiconductor sensor chip detects voltage variation. The housing has a cavity in which the semiconductor sensor chip is mounted. The opening portion has a plurality of through holes(25), which are formed in a regulated region of the housing. The opening portion causes the cavity to communicate with an external space. A substrate(15) has a chip mount surface mounting the semiconductor sensor chip. The cover member is connected to the substrate in order to form the cavity in the semiconductor sensor chip.</p> |
