发明名称 METHOD OF FORMING A TITANIUM ALUMINIUM NITRIDE LAYER AND METHOD OF FORMING A PHASE-CHANGE MEMORY DEVICE USING THE SAME
摘要 A method for forming a titanium aluminum nitride layer and a method for forming a phase-change memory device using the same are provided to enhance a throughput by improving characteristics of the titanium aluminum nitride layer. A first reactant is formed by inducing a reactance between a first source including titanium and a second source including nitrogen(S100). A second reactant is formed by providing a third source including aluminum onto the substrate including the first reactant and inducing the reactance between the first reactant and the third source(S120). A third reactant is formed by providing a fourth source including nitrogen onto the substrate including the second reactant and inducing the reactance between the second reactant and the fourth source(S140).
申请公布号 KR20080075575(A) 申请公布日期 2008.08.19
申请号 KR20070014629 申请日期 2007.02.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 OH, GYU HWAN;PARK, IN SUN;LIM, HYUN SEOK;LIM, NAK HYUN
分类号 H01L21/28 主分类号 H01L21/28
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