发明名称 |
Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility |
摘要 |
In a first aspect, a first method is provided for electronic device manufacturing. The first method includes the steps of (1) receiving a request to transfer a carrier from a first substrate loading station to a second substrate loading station of an electronic device manufacturing facility including a plurality of substrate loading stations, wherein the facility further includes a plurality of carrier supports coupled to a conveyor system adapted to move the carrier within the facility; (2) assigning one of the plurality of carrier supports to transfer the carrier from the first substrate loading station to the second substrate loading station such that at least one of a time required for the transfer is reduced and balance of the conveyor system is maintained; (3) moving the carrier from the first substrate loading station; and (4) moving the carrier to the second substrate loading station. Numerous other aspects are provided.
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申请公布号 |
US7413069(B2) |
申请公布日期 |
2008.08.19 |
申请号 |
US20050067460 |
申请日期 |
2005.02.25 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BRILL TODD J.;TEFERRA MICHAEL;PURI AMITABH;JESSOP DANIEL R.;WARNER GLADE L.;DUFFIN DAVID C. |
分类号 |
B65G47/46;B24B5/00;H01L21/00;H01L21/677 |
主分类号 |
B65G47/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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