Die and wafer failure classification system and method

摘要

A system and method for classifying failures of semiconductor integrated circuit dies using a unique input vector created from die level characterization data to classify wafer (process related) and die level (defect related) patterns. The failure classification may then be used to assign the appropriate yield loss by die. The classification results produced by the plurality of classifiers are examined with a preference towards assigning a wafer level failure classification to failure data for a die when any of the plurality of failure classification results indicates a presence of a wafer level failure.