发明名称 Structure and method of applying localized stresses to the channels of PFET and NFET transistors for improved performance
摘要 A semiconductor device has an n channel conductivity type field effect transistor having a channel formation region formed in a first region on one main surface of a semiconductor substrate and a p channel conductivity type field effect transistor having a channel formation region formed in a second region on the main surface of the semiconductor substrate, which second region is different from the first region. An internal stress generated in the channel formation region of the n channel conductivity type field effect transistor is different from an internal stress generated in the channel formation region of the p channel conductivity type field effect transistor. The internal stress generated in the channel formation region of the n channel conductivity type field effect transistor is a tensile stress, while the internal stress generated in the channel formation region of the p channel conductivity type field effect transistor is a compressive stress.
申请公布号 US7414293(B2) 申请公布日期 2008.08.19
申请号 US20060541575 申请日期 2006.10.03
申请人 发明人
分类号 H01L27/092;H01L21/265;H01L21/336;H01L21/8238 主分类号 H01L27/092
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