| 摘要 |
A press apparatus is provided to reduce a bonding fault of substrates by preventing omission and movement of electrostatically-sucked substrates. Within a treatment chamber(71), first or second support plate(72a,72b) is installed to support first or second substrate(W1,W2) respectively. The first support plate is connected to a first moving tool for upwardly and downwardly moving the first support plate installed in the outside of the treatment chamber as interposing plural first supports passing through the treatment chamber. The second support plate is connected to a second moving tool for moving the second support plate installed in the outside of the treatment chamber as interposing plural second supports passing through the treatment chamber. The second moving tool moves the second support plate in a horizontal direction relative to the treatment chamber. The second moving tool is supported independently of the treatment chamber. |
