| 摘要 |
A dechuck apparatus using a subpad with a recess is provided to prevent a latent deformation of a polishing sheet into a groove from being interfered with a polishing uniformity. A polishing apparatus includes a platen(100), a sub pad, a vacuum source, a carrier head(80), a motor(76), and a controller. The sub pad is formed on the platen to support a polishing sheet having a polishing surface. The sub pad has an inner recess. The vacuum source is connected to the recess of the sub pad and applies a vacuum state, such that the polishing sheet is attached to the recess of the sub pad. The carrier head holds a substrate with respect to the polishing surface and lifts the substrate away from the polishing surface. The motor moves the carrier head on the polishing surface. The controller is configured to arrange the substrate to be apart from the recess, while the substrate is polished, and control the carrier head to lift the substrate from the polishing surface, while the substrate is arranged over the recess of the polishing surface.
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