A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

摘要

A method of manufacturing a semiconductor device is provided to remove an oil component and an organic resolvent from one surface of a substrate by performing a cleaning process on the surface of the substrate. A connector(3) of a substrate(20) is electrically connected to a surface of an electrode pad(11) of a semiconductor chip(10) through a bonding wire(13). A cleaning process is performed to remove pollutants, such as an oxide film, an oil component, and an organic resolvent, from the surface of the electrode pad and the connector. A connection reliability of the wire bonding process is enhanced. The substrate is heated, such that the oil component and the organic resolvent are discharged from a resin film. Plural semiconductor chips are implemented on one surface(20X) of the substrate. A plasma cleaning process is performed to form a rough surface on the surface of the substrate.