发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 When chuck pins are in a releasing state, support pins for supporting a lower surface of a substrate at respective heights different from each other support the substrate in an inclined position. When the chuck pins are in a gripping state, substrate gripping parts grip a substrate sidewise to separate the substrate upwardly from a substrate rest part, thereby holding the substrate in a horizontal position at a predetermined gripping height. After a liquid mass covering the substrate is formed, the chuck pins are changed from the gripping state to the releasing state to support the substrate having been gripped in the horizontal position into an inclined position, thereby draining the liquid mass from the surface of the substrate. The substrate with the liquid mass drained from the surface thereof is held and rotated in a horizontal position. Thus, the substrate is dried. This allows the use of a simple structure to prevent the occurrence of water marks, thereby achieving good drying of the surface of the substrate.
申请公布号 US2008189975(A1) 申请公布日期 2008.08.14
申请号 US20080021391 申请日期 2008.01.29
申请人 MIYA KATSUHIKO 发明人 MIYA KATSUHIKO
分类号 F26B5/08;B65G47/24;F26B25/08;H01L21/687 主分类号 F26B5/08
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