发明名称 |
ARCHITECTURE FOR FACE-TO-FACE BONDING BETWEEN SUBSTRATE AND MULTIPLE DAUGHTER CHIPS |
摘要 |
An integrated circuit system includes a first integrated circuit die and a family of second integrated circuit dice. The first integrated circuit die have input/output circuits disposed thereon and further have a first array of face-to-face bonding structures disposed on a first face thereof. Each member of the family of second integrated circuit dice have logical function circuits disposed thereon and further have a second array of face-to-face bonding structures disposed on a first face thereof. The second array of face-to-face bonding structures of each member of the family mates with a different portion of the first array of face-to-face bonding structures.
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申请公布号 |
US2008191363(A1) |
申请公布日期 |
2008.08.14 |
申请号 |
US20080102765 |
申请日期 |
2008.04.14 |
申请人 |
ACTEL CORPORATION |
发明人 |
PLANTS WILLIAM C.;MCCOLLUM JOHN;SPEERS THEODORE |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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