发明名称 FRAME PACKAGED ARRAY ELECTRONIC COMPONENT
摘要 The present invention uses a frame with one or more axial ribs extending from a spine onto which two or more discrete two-terminal electronic components, such as capacitors, resistors, or inductors, can be attached. The function of the frame is to align and space the electronic components in a single device or array that allows the two-terminals of each component to be separately contacted or soldered to a PC board during final assembly into a circuit. The frame may use friction or a bonding agent to hold the components to the frame. Additionally, the base of the frame forms a single surface for the pick and place equipment used in circuit board assembly. The frame and any bonding agent must be capable of sustaining high temperature soldering operations to form electrical contacts in the circuit assembly operation.
申请公布号 US2008189931(A1) 申请公布日期 2008.08.14
申请号 US20080107349 申请日期 2008.04.22
申请人 VISHAY VITRAMON INC. 发明人 BULTITUDE JOHN
分类号 G01R31/28 主分类号 G01R31/28
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