| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for measuring a shape of a jig for heat treatment and its device capable of decreasing a damage and a crystal defect occuring on a wafer when the jig for heat treatment for mounting the wafer used in a heat treatment device in a semiconductor manufacturing process is manufactured. <P>SOLUTION: The positions of supporting parts 9, 18, 27 of the jig 5 for the heat treatment at the time of measuring the shape are made identical to the position of the holding part of a vertical-type heat treatment device. This can reproduce the deflection by its own weight of the jig 5 for the heat treatment on a measuring instrument for convenient purposes. Therefore, the shape capable of decreaing the damage and the crystal defect occuring on the wafer 3 is simply and accurately measured when the jig 5 for the heat treatment for mounting the wafer 3 used in the vertical-type heat treatment device in the semiconductor manufacturing process is manufactured. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
