发明名称 |
Wired circuit board and method for producing the same |
摘要 |
A wired circuit board includes: a first insulating layer; a conductive pattern formed on the first insulating layer and having a terminal portion; and a second insulating layer formed on the first insulating layer to cover the conductive pattern. A surface of the terminal portion is formed to be exposed from the first insulating layer and the second insulating layer. A tin alloy layer is formed at least on a top surface and both side surfaces of the terminal portion.
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申请公布号 |
US2008190652(A1) |
申请公布日期 |
2008.08.14 |
申请号 |
US20080068609 |
申请日期 |
2008.02.08 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
KAMEI KATSUTOSHI;NAKAMURA KAZUYA;THAVEEPRUNGSRIPORN VISIT |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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