PACKING MATERIAL PROVIDED WITH ELECTROMAGNETICALLY COUPLED MODULE

摘要

Provided is a packing material provided with an electromagnetically coupled module. The packing material protects a wireless IC chip from shock from external and environmental changes without deteriorating flatness of the packing material, facilitates assembly with the electromagnetically coupled module, has excellent radiation characteristics and is suitable for a RFID system. A packing material (20) is composed of liners (21, 22) and a wave-like core material (23), and electromagnetically coupled module (1) is arranged inside the packing material (20). The electromagnetically coupled module (1) is composed of a wireless IC chip (5) and a feed circuit board (10), which has the chip (5) mounted thereon and a resonance circuit including an inductance element. The packing material (20) is composed of a dielectric material, and high frequency signals are transmitted and received by electromagnetically coupling the dielectric material and the electromagnetically coupled module (1).