| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for pretreatment for electroless palladium plating where, even in the case an electroless palladium plating liquid including impurities such as copper is used, a palladium plating film can be stably precipitated over a nickel film. SOLUTION: Disclosed is an activation composition on a nickel surface for performing electroless palladium plating to the surface of nickel, which is composed of an aqueous solution comprising a palladium compound and hydrazines. Also disclosed is a method for forming a plating film onto a printed circuit board comprising a process where an electroless nickel plating film is formed on the conductor part of a printed circuit board, thereafter, activation treatment for the nickel plating film is performed using the above activation composition, and subsequently, electroless palladium plating is performed. COPYRIGHT: (C)2008,JPO&INPIT |
