摘要 |
A light emitting package includes a support (12, 112, 212) defining a support surface (14). A first light emitting diode chip (20, 120, 220) is secured to the supporting surface and is configured to emit light having a first spectral distribution. A second light emitting diode chip (22, 122, 123, 222) is secured to the first light emitting diode chip. The second light emitting diode chip is configured to emit light having a second spectral distribution different from the first spectral distribution. Optionally, a third light emitting diode chip (223) is disposed on the second light emitting diode chip (222). |
申请人 |
LUMINATION LLC;SACKRISON, MICHAEL;GAO, XIANG;AANEGOLA, SRINATH, K.;VENUGOPALAN, HARI, S. |
发明人 |
SACKRISON, MICHAEL;GAO, XIANG;AANEGOLA, SRINATH, K.;VENUGOPALAN, HARI, S. |