发明名称 SURFACE MOUNTING TYPE LIGHT EMITTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an inexpensive light emitting element easy in manufacture, low in cost, and uniform in light emission, in a light emitting element in which a light emission wavelength of an LED chip is changed by a fluorescent material. <P>SOLUTION: After mounting an LED chip 1, a translucent resin 2' is cured into a dome shape around the LED chip 1 in a recess formed by a substrate part 5 and a light reflecting part 4. Thereafter, a fluorescent material containing resin 3' is encapsulated and cured so as to cover the entire of the upper surface of the cured translucent resin 2'. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008187212(A) 申请公布日期 2008.08.14
申请号 JP20080121464 申请日期 2008.05.07
申请人 SHARP CORP 发明人 OKAZAKI ATSUSHI
分类号 H01L33/50;H01L33/54;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/50
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