| 摘要 |
PROBLEM TO BE SOLVED: To provide: a method for plating a substrate by which both surfaces of the substrate to be plated can be simultaneously plated, the plating process can be drastically shortened, and a metal plating film can be formed even in a through-hole and a hole pattern; a tool for substrate plating; and a substrate plating apparatus. SOLUTION: The tool 10 for substrate plating is used for dipping/holding a substrate to be plated in a plating solution in a plating tank of a plating apparatus. The tool 10 for substrate plating is provided with: a substrate holding mechanism (a first holding member 11 and a second holding member 12 are included) which seals a prescribed area of the peripheral edge part of the substrate to be plated to close the area and holds the substrate to be plated in such a state that the prescribed areas of both surfaces of the substrate to be plated are exposed; and electrode contacts which are arranged in a closed area and brought into contact with a conductive film of the surface of the substrate to be plated. COPYRIGHT: (C)2008,JPO&INPIT
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