| 摘要 |
The invention relates to a method for connecting a first surface ( 20 ) to a second surface in a soldering process by use of a solder containing melting point reducer. The invention also relates to a device having a first surface ( 20 ) and a second surface, which surfaces are connected to one another by soldering with a solder containing melting point reducer. The first surface ( 20 ) borders on a structure ( 15 a-f), part of which is brought into communication with the solder in order to transfer solder to the first surface. The structure ( 15 a-f) is partly in communication with the solder, which solder is connected to the first surface ( 20 ).
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