| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for manufacturing a highly reliable electronic device, and to provide a highly reliable electronic device and their manufacturing method. SOLUTION: The method for manufacturing an electronic device comprises a step for preparing a semiconductor device 1 including a semiconductor chip 10, a resin protrusion 20 formed on the semiconductor chip, and an interconnect 30 including an electric joint 32 arranged on the resin protrusion, a step for preparing a wiring board 2, and a step for mounting the semiconductor device 1 on the wiring board 2 and connecting the electric joint and a wiring pattern on the wiring board electrically by bringing them into contact with each other. The interconnect 30 includes a first wiring layer 34, and a second wiring layer 36 composed of a material more ductile than the first wiring layer. A plurality of first through holes 41 are formed at the first wiring layer, and second through holes 42 overlapping the first through holes 41 are formed at the second wiring layer. When the semiconductor device is mounted to the wiring board, the second wiring layer is deformed in order to close the second through holes. COPYRIGHT: (C)2008,JPO&INPIT
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