| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of further improving the operation efficiency of a testing device. SOLUTION: A first tool 7 for roughly positioning the semiconductor device 8 to a tester 5 is assembled to a turn table 9 inside an isothermal tank 3. The semiconductor device 8 is conveyed into the isothermal tank 3 and mounted to the first tool 7. A second tool 10 for further precisely positioning the semiconductor device 8 to the tester 5 is assembled after the temperature difference between it and the tip of a driving arm 4 becomes 50°C or lower. By operating the driving arm 4, the second tool 10 is engaged with the semiconductor device 8 mounted on the first tool 7. By operating the driving arm 4, the semiconductor device 8 is mounted to the tester 5 while the second tool 10 is engaged with the semiconductor device 8. COPYRIGHT: (C)2008,JPO&INPIT
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