| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF SAWING SEMICONDUCTOR DEVICE |
| 摘要 |
A method is disclosed for singulating die containing semiconductor device whereby a trench is etched at a first scribe region of a wafer comprising semiconductor devices, and sawing the wafer within the trench.
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| 申请公布号 |
US2008191318(A1) |
申请公布日期 |
2008.08.14 |
| 申请号 |
US20070673235 |
申请日期 |
2007.02.09 |
| 申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
SU MICHAEL ZHUOYING;FU LEI |
| 分类号 |
H01L21/00;H01L23/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
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