| 摘要 |
A bump structure comprises: a plurality of landing pads, a passive element, and a plurality of conductive bumps on a wafer. A method for manufacturing the bump comprises: providing a wafer with a plurality of landing pads, wherein the landing pads comprise a first landing pad and a second landing pad; forming a metal layer on each of the landing pads; forming a first photoresist to cover a surface of the wafer; forming a first opening on the first photoresist, wherein the first opening is disposed between the first landing pad and the second landing pad and exposes the partial metal layer on the first landing pad and the second landing pad; forming an electric resistance material in the first opening to electrically connect the first landing pad and the second landing pad; performing a curing step; and forming a plurality of conductive bumps on the metal layer of each of the landing pads. |
