A method for dry treating a sputter target using a plasma to significantly reduce burn-in time of the target by removing surface contaminants and also a minimal thickness of the deformed layer characteristics of a machined surface, the target so produced, and apparatus used for the target treatment.
申请公布号
WO2008067150(A3)
申请公布日期
2008.08.14
申请号
WO2007US84401
申请日期
2007.11.12
申请人
PRAXAIR TECHNOLOGY, INC.;SARKAR, JAYDEEP;MCDONALD, PETER;GILMAN, PAUL, S.
