| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition giving a cured material having good flexibility and heat-resistance, especially good adhesiveness to a substrate film in the use as a flexible printed circuit board, and capable of imparting a flexible printed circuit board with excellent flexibility and soldering heat-resistance and to provide a cured material of the resin composition. SOLUTION: The curable resin composition contains, as essential components, a carboxyl-containing photopolymerizable resin containing a chemical structure (I) as a partial structure in the molecular structure, a photopolymerization initiator and an epoxy resin, wherein the chemical structure (I) has an alkoxy-containing condensed polycyclic aromatic hydrocarbon group bonded to other structural site through a bivalent hydrocarbon group selected from a methylene group, an alkylidene group and a methylene group containing an aromatic hydrocarbon structure. COPYRIGHT: (C)2008,JPO&INPIT |
